JPH019158Y2 - - Google Patents

Info

Publication number
JPH019158Y2
JPH019158Y2 JP1982021904U JP2190482U JPH019158Y2 JP H019158 Y2 JPH019158 Y2 JP H019158Y2 JP 1982021904 U JP1982021904 U JP 1982021904U JP 2190482 U JP2190482 U JP 2190482U JP H019158 Y2 JPH019158 Y2 JP H019158Y2
Authority
JP
Japan
Prior art keywords
wire
lead frame
lead
chip
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982021904U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58124948U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982021904U priority Critical patent/JPS58124948U/ja
Publication of JPS58124948U publication Critical patent/JPS58124948U/ja
Application granted granted Critical
Publication of JPH019158Y2 publication Critical patent/JPH019158Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item

Landscapes

  • Wire Bonding (AREA)
JP1982021904U 1982-02-17 1982-02-17 ワイヤボンデイング装置 Granted JPS58124948U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982021904U JPS58124948U (ja) 1982-02-17 1982-02-17 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982021904U JPS58124948U (ja) 1982-02-17 1982-02-17 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS58124948U JPS58124948U (ja) 1983-08-25
JPH019158Y2 true JPH019158Y2 (en]) 1989-03-13

Family

ID=30034011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982021904U Granted JPS58124948U (ja) 1982-02-17 1982-02-17 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS58124948U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286832A (ja) * 1985-10-14 1987-04-21 Nec Corp Ｉｃリ−ドフレ−ム搬送装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329576B2 (en]) * 1975-01-31 1978-08-22

Also Published As

Publication number Publication date
JPS58124948U (ja) 1983-08-25

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